AM29LV400BB-90ED
vs
AM29LV400T-90RFI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
TSOP
|
|
| Package Description |
TSOP1,
|
,
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Access Time-Max |
90 ns
|
|
| Additional Feature |
CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION
|
|
| JESD-30 Code |
R-PDSO-G48
|
|
| JESD-609 Code |
e3
|
|
| Length |
18.4 mm
|
|
| Memory Density |
4194304 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
48
|
|
| Number of Words |
524288 words
|
|
| Number of Words Code |
512000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
512KX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSOP1
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
12 mm
|
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
|
|
|
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