AM29LV640DU121RWHEN vs AM29DL640D120WHI feature comparison

AM29LV640DU121RWHEN AMD

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AM29DL640D120WHI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description TFBGA, BGA63,8X12,32
Pin Count 63
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 120 ns 120 ns
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0
Length 12 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 128 16,126
Number of Terminals 63 63
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA63,8X12,32 BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm
Sector Size 32K 8K,64K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.03 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 11 mm
Base Number Matches 3 3
Alternate Memory Width 8
Boot Block BOTTOM/TOP
Power Supplies 3/3.3 V

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