AM29LV640DU150WHE vs KFM1G16Q2M-DEB50 feature comparison

AM29LV640DU150WHE AMD

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KFM1G16Q2M-DEB50 Samsung Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, VFBGA, BGA63,10X12,32
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns 76 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Memory Density 67108864 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 4194304 words 67108864 words
Number of Words Code 4000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -30 °C
Organization 4MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 1.8 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.7 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 1
Rohs Code Yes
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Command User Interface YES
Data Polling NO
JESD-609 Code e1
Length 13 mm
Moisture Sensitivity Level 2
Number of Sectors/Size 1K
Package Equivalence Code BGA63,10X12,32
Page Size 1K words
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 64K
Standby Current-Max 0.00005 A
Supply Current-Max 0.04 mA
Terminal Finish TIN SILVER COPPER
Terminal Pitch 0.8 mm
Toggle Bit YES
Type SLC NAND TYPE
Width 10 mm

Compare AM29LV640DU150WHE with alternatives

Compare KFM1G16Q2M-DEB50 with alternatives