AM29LV800BT90EC vs MBM29SL800TD-10TR feature comparison

AM29LV800BT90EC AMD

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MBM29SL800TD-10TR FUJITSU Semiconductor Limited

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code TSOP1 TSOP1
Package Description MO-142DD, TSOP-48 PLASTIC, REVERSE, TSOP1-48
Pin Count 48 48
Reach Compliance Code unknown unknown
Access Time-Max 90 ns 100 ns
Additional Feature CONFG AS 512K X 16; TOP BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 16777216 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 2.2 V
Supply Voltage-Min (Vsup) 2.7 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

Compare AM29LV800BT90EC with alternatives

Compare MBM29SL800TD-10TR with alternatives