AM29SL400CT-100REI vs MBM29LV004TC-70PTR feature comparison

AM29SL400CT-100REI Spansion

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MBM29LV004TC-70PTR FUJITSU Semiconductor Limited

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code TSOP1 TSOP1
Package Description TSOP1, PLASTIC, REVERSE, TSOP1-40
Pin Count 48 40
Reach Compliance Code compliant unknown
Access Time-Max 100 ns 70 ns
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48 R-PDSO-G40
JESD-609 Code e0
Length 18.4 mm 18.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 40
Number of Words 262144 words 524288 words
Number of Words Code 256000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 2.2 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 3 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm 10 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

Compare AM29SL400CT-100REI with alternatives

Compare MBM29LV004TC-70PTR with alternatives