AM29SL400CT-100RWAI vs AM29SL400CT-100RWAD feature comparison

AM29SL400CT-100RWAI AMD

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AM29SL400CT-100RWAD Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, 6 X 8 MM, 0.80 MM PITCH, FBGA-48
Pin Count 48 48
Reach Compliance Code unknown compliant
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8.15 mm 8.15 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.2 V 2.2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 6.15 mm 6.15 mm
Base Number Matches 2 2
Rohs Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AM29SL400CT-100RWAI with alternatives

Compare AM29SL400CT-100RWAD with alternatives