AM3354BZCZA80 vs AM3352ZCZD72 feature comparison

AM3354BZCZA80 Texas Instruments

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AM3352ZCZD72 Texas Instruments

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description LFBGA, BGA324,18X18,32 LFBGA, BGA324,18X18,32
Reach Compliance Code compliant compliant
ECCN Code 5A992.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Address Bus Width 28 28
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 26 MHz 26 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Length 15 mm 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 64
Number of Terminals 324 324
On Chip Data RAM Width 8
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (words) 131072
Seated Height-Max 1.4 mm 1.4 mm
Speed 800 MHz 720 MHz
Supply Current-Max 400 mA
Supply Voltage-Max 1.326 V 1.326 V
Supply Voltage-Min 1.21 V 1.21 V
Supply Voltage-Nom 1.26 V 1.26 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Part Package Code BGA
Pin Count 324

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