AM3517AZER
vs
XPC7451RX733PG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA-484
|
BGA,
|
| Pin Count |
484
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
|
| Bit Size |
16
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
26 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B484
|
S-CBGA-B484
|
| JESD-609 Code |
e1
|
|
| Length |
23 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
32
|
|
| Number of Terminals |
484
|
484
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
90 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA484,22X22,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
65536
|
|
| Seated Height-Max |
2.48 mm
|
|
| Speed |
600 MHz
|
733 MHz
|
| Supply Current-Max |
1500 mA
|
|
| Supply Voltage-Max |
1.248 V
|
1.85 V
|
| Supply Voltage-Min |
1.152 V
|
1.75 V
|
| Supply Voltage-Nom |
1.2 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
23 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
5
|
1
|
|
|
|
Compare AM3517AZER with alternatives
Compare XPC7451RX733PG with alternatives