AM41DL1624DB70FS vs AM41DL1624DB70IT feature comparison

AM41DL1624DB70FS Spansion

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AM41DL1624DB70IT Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 11 MM, FBGA-69
Pin Count 69 69
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 2M X 8 STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 2M X 8
JESD-30 Code R-PBGA-B69 R-PBGA-B69
JESD-609 Code e1 e0
Length 11 mm 11 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 69 69
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Access Time-Max 70 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA69,10X10,32
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.045 mA

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