AR02BPC3Y38R3N vs RP73F1E38R3BTDG feature comparison

AR02BPC3Y38R3N Token Electronics Industry Co Ltd

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RP73F1E38R3BTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer TOKEN ELECTRONICS INDUSTRY CO LTD TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method Bulk TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.0625 W 0.063 W
Resistance 38.3 Ω 38.3 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Package Description CHIP
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard MIL-STD-202
Series RP73

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Compare RP73F1E38R3BTDG with alternatives