AS4C4M16SA-6BAN
vs
AS4C4M16S-7TCN
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ALLIANCE MEMORY INC
|
ALLIED COMPONENTS INTERNATIONAL
|
Package Description |
FBGA-54
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.02
|
|
Factory Lead Time |
12 Weeks
|
|
Samacsys Manufacturer |
Alliance Memory
|
|
Access Mode |
FOUR BANK PAGE BURST
|
|
Access Time-Max |
5.4 ns
|
|
Additional Feature |
AUTO REFRESH/SELF REFRESH
|
|
Clock Frequency-Max (fCLK) |
166 MHz
|
|
I/O Type |
COMMON
|
|
Interleaved Burst Length |
1,2,4,8
|
|
JESD-30 Code |
S-PBGA-B54
|
|
JESD-609 Code |
e1
|
|
Length |
8 mm
|
|
Memory Density |
67108864 bit
|
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
16
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
54
|
|
Number of Words |
4194304 words
|
|
Number of Words Code |
4000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
4MX16
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TFBGA
|
|
Package Equivalence Code |
BGA54,9X9,32
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Refresh Cycles |
4096
|
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.2 mm
|
|
Self Refresh |
YES
|
|
Sequential Burst Length |
1,2,4,8,FP
|
|
Standby Current-Max |
0.03 A
|
|
Supply Current-Max |
0.075 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
8 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
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