Parametric results for: DRAMs

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K4M28163LF-RN75
Samsung Semiconductor
Check for Price No Active 134.2177 Mbit 16 8MX16 2.5 V 2.5 V 5.4 ns 133 MHz 4096 SYNCHRONOUS DRAM COMMON 1,2,4,8 8000000 8.3886 M 3-STATE 1,2,4,8,FP 500 µA 155 µA CMOS OTHER S-PBGA-B54 Not Qualified e0 85 °C -25 °C 54 PLASTIC/EPOXY FBGA BGA54,9X9,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC compliant EAR99 8542.32.00.02
MSC2327C-80BS8
LAPIS Semiconductor Co Ltd
Check for Price Active 8.3886 Mbit 32 256KX32 5 V 5 V 80 ns 512 FAST PAGE DRAM MODULE COMMON 256000 262.144 k 3-STATE 8 mA 400 µA CMOS COMMERCIAL R-PSMA-N72 Not Qualified 70 °C 72 PLASTIC/EPOXY SIMM SSIM72 RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD 1.27 mm SINGLE 25.4 mm LAPIS SEMICONDUCTOR CO LTD unknown EAR99 8542.32.00.02 SIMM, SSIM72
MCM5L4400AZ80
Freescale Semiconductor
Check for Price No Obsolete 4.1943 Mbit 4 1MX4 5 V 5 V 80 ns 1024 FAST PAGE DRAM COMMON 1000000 1.0486 M 3-STATE NO 200 µA 85 µA CMOS COMMERCIAL R-PZIP-T20 Not Qualified e0 70 °C 20 PLASTIC/EPOXY ZIP ZIP20,.1 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 1.27 mm ZIG-ZAG MOTOROLA SEMICONDUCTOR PRODUCTS unknown ZIP, ZIP20,.1 MCM5L4400AZ80
HYB18T512400B2FL-5
Qimonda AG
Check for Price Yes Obsolete 536.8709 Mbit 4 128MX4 1.8 V 1.8 V 600 ps 200 MHz 8192 DDR DRAM COMMON 4,8 128000000 134.2177 M 3-STATE 4,8 3 mA 140 µA CMOS COMMERCIAL R-PBGA-B60 Not Qualified 70 °C 60 PLASTIC/EPOXY FBGA BGA60,9X11,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM QIMONDA AG unknown EAR99 8542.32.00.28 FBGA, BGA60,9X11,32
V58C2256164SGLS45
ProMOS Technologies Inc
Check for Price Obsolete PROMOS TECHNOLOGIES INC compliant EAR99 ,
SMR32RANAD01
SMART Modular Technology Inc
Check for Price Obsolete SMART MODULAR TECHNOLOGIES unknown EAR99
AS4C256M16D3C-93BCN
Alliance Memory Inc
Check for Price Active 4.295 Gbit 16 256MX16 1.5 V 1.066 GHz 8192 MULTI BANK PAGE BURST DDR3 DRAM COMMON 4,8 1 1 256000000 268.4355 M SYNCHRONOUS 3-STATE YES 4,8 8 mA 1.425 V 210 µA 1.575 V 1.425 V CMOS OTHER R-PBGA-B96 e1 3 95 °C 260 30 96 PLASTIC/EPOXY TFBGA BGA96,9X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13.5 mm 7.5 mm ALLIANCE MEMORY INC unknown EAR99 8542.32.00.36 , 2020-06-05
IC41LV4100-50TI
Integrated Circuit Solution Inc
Check for Price No Transferred 4.1943 Mbit 4 1MX4 3.3 V 3.3 V 50 ns 1024 EDO DRAM COMMON 1000000 1.0486 M 3-STATE NO 500 µA 95 µA CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e0 85 °C -40 °C 20 PLASTIC/EPOXY TSOP TSOP20/26,.36 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL INTEGRATED CIRCUIT SOLUTION INC unknown EAR99 8542.32.00.02 TSOP, TSOP20/26,.36
K1C1616B2B-BI700
Samsung Semiconductor
Check for Price Obsolete SAMSUNG SEMICONDUCTOR INC unknown EAR99 ,
SM564048072N6BP
SMART Modular Technology Inc
Check for Price Obsolete SMART MODULAR TECHNOLOGIES unknown EAR99 ,