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K4M28163LF-RN75
Samsung Semiconductor
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Check for Price | No | Active | 134.2177 Mbit | 16 | 8MX16 | 2.5 V | 2.5 V | 5.4 ns | 133 MHz | 4096 | SYNCHRONOUS DRAM | COMMON | 1,2,4,8 | 8000000 | 8.3886 M | 3-STATE | 1,2,4,8,FP | 500 µA | 155 µA | CMOS | OTHER | S-PBGA-B54 | Not Qualified | e0 | 85 °C | -25 °C | 54 | PLASTIC/EPOXY | FBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | compliant | EAR99 | 8542.32.00.02 | |||||||||||||||||||
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MSC2327C-80BS8
LAPIS Semiconductor Co Ltd
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Check for Price | Active | 8.3886 Mbit | 32 | 256KX32 | 5 V | 5 V | 80 ns | 512 | FAST PAGE DRAM MODULE | COMMON | 256000 | 262.144 k | 3-STATE | 8 mA | 400 µA | CMOS | COMMERCIAL | R-PSMA-N72 | Not Qualified | 70 °C | 72 | PLASTIC/EPOXY | SIMM | SSIM72 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.27 mm | SINGLE | 25.4 mm | LAPIS SEMICONDUCTOR CO LTD | unknown | EAR99 | 8542.32.00.02 | SIMM, SSIM72 | ||||||||||||||||||||||||
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MCM5L4400AZ80
Freescale Semiconductor
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Check for Price | No | Obsolete | 4.1943 Mbit | 4 | 1MX4 | 5 V | 5 V | 80 ns | 1024 | FAST PAGE DRAM | COMMON | 1000000 | 1.0486 M | 3-STATE | NO | 200 µA | 85 µA | CMOS | COMMERCIAL | R-PZIP-T20 | Not Qualified | e0 | 70 °C | 20 | PLASTIC/EPOXY | ZIP | ZIP20,.1 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 1.27 mm | ZIG-ZAG | MOTOROLA SEMICONDUCTOR PRODUCTS | unknown | ZIP, ZIP20,.1 | MCM5L4400AZ80 | ||||||||||||||||||||||
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HYB18T512400B2FL-5
Qimonda AG
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Check for Price | Yes | Obsolete | 536.8709 Mbit | 4 | 128MX4 | 1.8 V | 1.8 V | 600 ps | 200 MHz | 8192 | DDR DRAM | COMMON | 4,8 | 128000000 | 134.2177 M | 3-STATE | 4,8 | 3 mA | 140 µA | CMOS | COMMERCIAL | R-PBGA-B60 | Not Qualified | 70 °C | 60 | PLASTIC/EPOXY | FBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | QIMONDA AG | unknown | EAR99 | 8542.32.00.28 | FBGA, BGA60,9X11,32 | |||||||||||||||||||||
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V58C2256164SGLS45
ProMOS Technologies Inc
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Check for Price | Obsolete | PROMOS TECHNOLOGIES INC | compliant | EAR99 | , | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SMR32RANAD01
SMART Modular Technology Inc
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Check for Price | Obsolete | SMART MODULAR TECHNOLOGIES | unknown | EAR99 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS4C256M16D3C-93BCN
Alliance Memory Inc
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Check for Price | Active | 4.295 Gbit | 16 | 256MX16 | 1.5 V | 1.066 GHz | 8192 | MULTI BANK PAGE BURST | DDR3 DRAM | COMMON | 4,8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 8 mA | 1.425 V | 210 µA | 1.575 V | 1.425 V | CMOS | OTHER | R-PBGA-B96 | e1 | 3 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 13.5 mm | 7.5 mm | ALLIANCE MEMORY INC | unknown | EAR99 | 8542.32.00.36 | , | 2020-06-05 | ||||||||
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IC41LV4100-50TI
Integrated Circuit Solution Inc
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Check for Price | No | Transferred | 4.1943 Mbit | 4 | 1MX4 | 3.3 V | 3.3 V | 50 ns | 1024 | EDO DRAM | COMMON | 1000000 | 1.0486 M | 3-STATE | NO | 500 µA | 95 µA | CMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e0 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | TSOP | TSOP20/26,.36 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | INTEGRATED CIRCUIT SOLUTION INC | unknown | EAR99 | 8542.32.00.02 | TSOP, TSOP20/26,.36 | ||||||||||||||||||||
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K1C1616B2B-BI700
Samsung Semiconductor
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Check for Price | Obsolete | SAMSUNG SEMICONDUCTOR INC | unknown | EAR99 | , | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SM564048072N6BP
SMART Modular Technology Inc
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Check for Price | Obsolete | SMART MODULAR TECHNOLOGIES | unknown | EAR99 | , |