AS4SD32M16DGC-75/XT
vs
AS4C32M16SB-7BINTR
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
AUSTIN SEMICONDUCTOR INC
|
ALLIANCE MEMORY INC
|
| Part Package Code |
TSOP2
|
|
| Package Description |
TSOP2,
|
|
| Pin Count |
54
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Factory Lead Time |
|
8 Weeks
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
5.4 ns
|
5.4 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
|
| JESD-30 Code |
R-PDSO-G54
|
S-PBGA-B54
|
| Length |
22.22 mm
|
8 mm
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
33554432 words
|
33554432 words
|
| Number of Words Code |
32000000
|
32000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
32MX16
|
32MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP2
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
10.16 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2020-03-11
|
| Samacsys Manufacturer |
|
Alliance Memory
|
| Clock Frequency-Max (fCLK) |
|
143 MHz
|
| I/O Type |
|
COMMON/SEPARATE
|
| Interleaved Burst Length |
|
1,2,4,8
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA54,9X9,32
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Refresh Cycles |
|
8192
|
| Sequential Burst Length |
|
1,2,4,8,FP
|
| Standby Current-Max |
|
0.008 A
|
| Standby Voltage-Min |
|
3 V
|
| Supply Current-Max |
|
0.12 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AS4SD32M16DGC-75/XT with alternatives
Compare AS4C32M16SB-7BINTR with alternatives