AS6C4008A-55TIN vs AS6C4008-55BIN feature comparison

AS6C4008A-55TIN Alliance Memory Inc

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AS6C4008-55BIN Alliance Memory Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ALLIANCE MEMORY INC ALLIANCE MEMORY INC
Part Package Code TSOP1 BGA
Package Description 8 X 20 MM, GREEN, TSOP1-32 TFBGA, BGA36,6X8,30
Pin Count 32 36
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Samacsys Manufacturer Alliance Memory Alliance Memory
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDSO-G32 R-PBGA-B36
JESD-609 Code e3/e6
Length 18.4 mm 8 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 36
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.75 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm 6 mm
Base Number Matches 2 2
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA36,6X8,30
Qualification Status Not Qualified
Standby Current-Max 0.00003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.06 mA

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