AS7C1025C-12JIN
vs
L7C108KMB12
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALLIANCE MEMORY INC
|
LOGIC DEVICES INC
|
Part Package Code |
SOIC
|
QFJ
|
Package Description |
0.400 INCH, LEAD FREE, PLASTIC, SO-32
|
QCCN,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.B
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Samacsys Manufacturer |
Alliance Memory
|
|
Access Time-Max |
12 ns
|
12 ns
|
JESD-30 Code |
R-PDSO-J32
|
R-CQCC-N32
|
Length |
20.955 mm
|
17.78 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
128KX8
|
128KX8
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOJ
|
QCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
245
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.7 mm
|
2.54 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
10.16 mm
|
11.43 mm
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
AUTOMATIC POWER DOWN; BATTERY BACKUP
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare AS7C1025C-12JIN with alternatives
Compare L7C108KMB12 with alternatives