AS7C251MNTD18A-225TQI vs TC55WD1618FF-133 feature comparison

AS7C251MNTD18A-225TQI Alliance Semiconductor Corporation

Buy Now Datasheet

TC55WD1618FF-133 Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP TOSHIBA CORP
Part Package Code QFP QFP
Package Description LQFP, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 6.9 ns 4.2 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX18 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.65 V 2.625 V
Supply Voltage-Min (Vsup) 2.35 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AS7C251MNTD18A-225TQI with alternatives

Compare TC55WD1618FF-133 with alternatives