AS7C331MPFS18A-133TQCN vs MCM63R818FC3 feature comparison

AS7C331MPFS18A-133TQCN Alliance Semiconductor Corporation

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MCM63R818FC3 Freescale Semiconductor

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP FREESCALE SEMICONDUCTOR INC
Part Package Code QFP BGA
Package Description LQFP, QFP100,.63X.87 BGA,
Pin Count 100 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.8 ns 1.5 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e3
Length 20 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type STANDARD SRAM LATE-WRITE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.77 mm
Standby Current-Max 0.04 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.27 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 6

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