MCM63R818FC3 vs IS61LF25618A-6.5B2I feature comparison

MCM63R818FC3 NXP Semiconductors

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IS61LF25618A-6.5B2I Integrated Silicon Solution Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED SILICON SOLUTION INC
Package Description BGA, BGA, BGA119,7X17,50
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 1.5 ns 6.5 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type LATE-WRITE SRAM CACHE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 2.77 mm 2.41 mm
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 4 2
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 119
Additional Feature FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Qualification Status Not Qualified
Standby Current-Max 0.035 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.18 mA
Terminal Finish TIN LEAD

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