AS8S512K32BQFP-20/883C
vs
CY7C194-25KMB
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFP
|
|
| Package Description |
QFF,
|
DFP,
|
| Pin Count |
68
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
20 ns
|
25 ns
|
| JESD-30 Code |
S-CQFP-F68
|
R-CDFP-F24
|
| Length |
39.625 mm
|
15.367 mm
|
| Memory Density |
16777216 bit
|
262144 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
32
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
24
|
| Number of Words |
524288 words
|
65536 words
|
| Number of Words Code |
512000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512KX32
|
64KX4
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
DFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.1 mm
|
2.286 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
39.625 mm
|
9.652 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
AUTOMATIC POWER-DOWN
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AS8S512K32BQFP-20/883C with alternatives
Compare CY7C194-25KMB with alternatives