AS9C25256M2018L-166FC vs IDT70V7319S133BFGI8 feature comparison

AS9C25256M2018L-166FC Alliance Semiconductor Corporation

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IDT70V7319S133BFGI8 Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, TFBGA,
Pin Count 208 208
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 208 208
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.6 V 3.45 V
Supply Voltage-Min (Vsup) 2.4 V 3.15 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 2 1
Pbfree Code Yes
Moisture Sensitivity Level 3

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