AT24C02CU3-CUM-T
vs
M95M02-DRCS6TP/K
feature comparison
| Source Content uid |
AT24C02CU3-CUM-T
|
M95M02-DRCS6TP/K
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Package Description |
2 X 1.50 MM, 0.50 MM PITCH, GREEN, VFBGA-8
|
VFBGA, BGA8(UNSPEC)
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.B.1
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
100 YEAR DATA RETENTION
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
5 MHz
|
| Data Retention Time-Min |
100
|
200
|
| JESD-30 Code |
R-PBGA-B8
|
R-PBGA-B8
|
| JESD-609 Code |
e3
|
e1
|
| Length |
2 mm
|
3.556 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.85 mm
|
0.58 mm
|
| Serial Bus Type |
I2C
|
SPI
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
1.5 mm
|
2.011 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Base Number Matches |
1
|
1
|
| Endurance |
|
4000000 Write/Erase Cycles
|
| Package Equivalence Code |
|
BGA8(UNSPEC)
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supplies |
|
2/5 V
|
| Standby Current-Max |
|
0.000003 A
|
| Supply Current-Max |
|
0.003 mA
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare AT24C02CU3-CUM-T with alternatives
Compare M95M02-DRCS6TP/K with alternatives