AT24C02D-XHM-B
vs
AT24C02D-WWU11-T
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP, TSSOP8,.25
|
,
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ
|
|
Clock Frequency-Max (fCLK) |
0.4 MHz
|
|
Data Retention Time-Min |
100
|
|
Endurance |
1000000 Write/Erase Cycles
|
|
I2C Control Byte |
1010DDDR
|
|
JESD-30 Code |
R-PDSO-G8
|
|
JESD-609 Code |
e4
|
|
Length |
4.4 mm
|
|
Memory Density |
2048 bit
|
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
|
Number of Words |
256 words
|
|
Number of Words Code |
256
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
256X8
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TSSOP
|
|
Package Equivalence Code |
TSSOP8,.25
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Parallel/Serial |
SERIAL
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
|
Serial Bus Type |
I2C
|
I2C
|
Standby Current-Max |
4e-7 A
|
|
Supply Current-Max |
0.001 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
1.7 V
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
|
Width |
3 mm
|
|
Write Cycle Time-Max (tWC) |
5 ms
|
|
Write Protection |
HARDWARE
|
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2018-11-12
|
|
|
|
Compare AT24C02D-XHM-B with alternatives
Compare AT24C02D-WWU11-T with alternatives