AT24C04-10PC-2.5
vs
24LC04BT-E/MNY
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
DFN
|
| Package Description |
0.300 INCH, PLASTIC, DIP-8
|
TDFN-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
2-WIRE SERIAL INTERFACE
|
|
| Clock Frequency-Max (fCLK) |
0.1 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
100
|
200
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010DDXR
|
1010XXMR
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
9.59 mm
|
3 mm
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
512X8
|
512X8
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVSON
|
| Package Equivalence Code |
DIP8,.3
|
SOLCC8,.11,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.33 mm
|
0.8 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000004 A
|
0.000005 A
|
| Supply Current-Max |
0.003 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
2 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
7 Weeks
|
| Date Of Intro |
|
1991-01-01
|
| Samacsys Manufacturer |
|
Microchip
|
| Moisture Sensitivity Level |
|
1
|
| Number of Ports |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programming Voltage |
|
5 V
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AT24C04-10PC-2.5 with alternatives
Compare 24LC04BT-E/MNY with alternatives