AT24C16C-MAPDGV-T
vs
AT24C16C-PUM
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
UDFN-8
|
DIP, DIP8,.3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
1 MHz
|
| Data Retention Time-Min |
100
|
100
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
1010MMMR
|
1010MMMR
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDIP-T8
|
| Length |
3 mm
|
9.271 mm
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
2KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
DIP
|
| Package Equivalence Code |
SOLCC8,.11,20
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Page Size |
16 words
|
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
5 V
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.6 mm
|
5.334 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000006 A
|
0.000001 A
|
| Supply Current-Max |
0.003 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
2 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AT24C16C-MAPDGV-T with alternatives
Compare AT24C16C-PUM with alternatives