AT27BV256-70JU
vs
AM27X256-70JI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFJ
|
|
| Package Description |
GREEN, PLASTIC, MS-016AE, LCC-32
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Access Time-Max |
70 ns
|
|
| Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PQCC-J32
|
|
| JESD-609 Code |
e3
|
|
| Length |
13.97 mm
|
|
| Memory Density |
262144 bit
|
|
| Memory IC Type |
OTP ROM
|
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
|
| Number of Words |
32768 words
|
|
| Number of Words Code |
32000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Equivalence Code |
LDCC32,.5X.6
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programming Voltage |
13 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.556 mm
|
|
| Standby Current-Max |
0.00002 A
|
|
| Supply Current-Max |
0.02 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
11.43 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|