AT27LV520-70SU
vs
AT27LV520-70SL
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
0.300 INCH, GREEN, PLASTIC, MS-013, SOIC-20
|
SOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
CAN ALSO BE OPERATED AT 5V
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
12.8 mm
|
12.8 mm
|
| Memory Density |
524288 bit
|
524288 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
64KX8
|
64KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
20
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare AT27LV520-70SU with alternatives
Compare AT27LV520-70SL with alternatives