AT45D011-XC
vs
AT45DB011B-XC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
TSSOP
|
| Package Description |
|
4.40 MM, PLASTIC, MO-153AB-1, TSSOP-14
|
| Pin Count |
|
14
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Samacsys Manufacturer |
|
Microchip
|
| Additional Feature |
|
ORGANIZED AS 512 PAGES OF 264 BYTES EACH
|
| Clock Frequency-Max (fCLK) |
|
20 MHz
|
| JESD-30 Code |
|
R-PDSO-G14
|
| JESD-609 Code |
|
e0
|
| Length |
|
5 mm
|
| Memory Density |
|
1048576 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
1
|
| Moisture Sensitivity Level |
|
2
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
14
|
| Number of Words |
|
1048576 words
|
| Number of Words Code |
|
1000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
1MX1
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP14,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Programming Voltage |
|
2.7 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Serial Bus Type |
|
SPI
|
| Standby Current-Max |
|
0.00001 A
|
| Supply Current-Max |
|
0.025 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Type |
|
NOR TYPE
|
| Width |
|
4.4 mm
|
| Write Protection |
|
HARDWARE
|
|
|
|
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