AT45DB011B-XU
vs
AT45D011-XI
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
4.40 MM, GREEN, PLASTIC, MO-153AB-1, TSSOP-14
|
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Additional Feature |
ORGANIZED AS 512 PAGES OF 264 BYTES EACH
|
|
| Clock Frequency-Max (fCLK) |
20 MHz
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
|
| Memory Density |
1048576 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
1
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
14
|
|
| Number of Words |
1048576 words
|
|
| Number of Words Code |
1000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1MX1
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Parallel/Serial |
SERIAL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
2.7 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.00001 A
|
|
| Supply Current-Max |
0.025 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Type |
NOR TYPE
|
|
| Width |
4.4 mm
|
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare AT45DB011B-XU with alternatives