AT45DB021B-CI
vs
AT45DB021B-CJ
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9
|
5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
ORGANIZED AS 1024 PAGES OF 264 BYTES EACH
|
ORGANIZED AS 1024 PAGES OF 264 BYTES EACH
|
| Clock Frequency-Max (fCLK) |
20 MHz
|
20 MHz
|
| JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
| JESD-609 Code |
e0
|
e1
|
| Length |
5 mm
|
5 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2MX1
|
2MX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
TBGA
|
| Package Equivalence Code |
BGA9,3X3,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.00001 A
|
|
| Supply Current-Max |
0.035 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
5 mm
|
5 mm
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AT45DB021B-CI with alternatives
Compare AT45DB021B-CJ with alternatives