AT45DB021B-CI vs AT45DB021B-CL feature comparison

AT45DB021B-CI Atmel Corporation

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AT45DB021B-CL Atmel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code BGA BGA
Package Description 5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9 5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9
Pin Count 9 9
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature ORGANIZED AS 1024 PAGES OF 264 BYTES EACH ORGANIZED AS 1024 PAGES OF 264 BYTES EACH
Clock Frequency-Max (fCLK) 20 MHz 20 MHz
JESD-30 Code S-PBGA-B9 S-PBGA-B9
JESD-609 Code e0 e1
Length 5 mm 5 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 9 9
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX1 2MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA9,3X3,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 5 mm 5 mm
Write Protection HARDWARE
Base Number Matches 1 1
Pbfree Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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