AT45DB021B-CI
vs
AT45DB021B-CL
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9
5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9
Pin Count
9
9
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
ORGANIZED AS 1024 PAGES OF 264 BYTES EACH
ORGANIZED AS 1024 PAGES OF 264 BYTES EACH
Clock Frequency-Max (fCLK)
20 MHz
20 MHz
JESD-30 Code
S-PBGA-B9
S-PBGA-B9
JESD-609 Code
e0
e1
Length
5 mm
5 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
9
9
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX1
2MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA9,3X3,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.035 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
5 mm
5 mm
Write Protection
HARDWARE
Base Number Matches
1
1
Pbfree Code
Yes
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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