AT45DB021E-SHN-B
vs
AT45DB021D-SH-B
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
End Of Life
|
| Ihs Manufacturer |
DIALOG SEMICONDUCTOR GMBH
|
RENESAS ELECTRONICS CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Clock Frequency-Max (fCLK) |
70 MHz
|
66 MHz
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5.29 mm
|
5.29 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2MX1
|
2MX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Seated Height-Max |
2.16 mm
|
2.16 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
|
| Width |
5.24 mm
|
5.24 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
0.208 INCH, GREEN, PLASTIC, SOIC-8
|
|
|
|
Compare AT45DB021E-SHN-B with alternatives
Compare AT45DB021D-SH-B with alternatives