AT88SC0204C-Y4I
vs
AT88SC0204C-WI
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Package Description |
SON, SOLCC8,.25
|
DIE,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| JESD-30 Code |
R-PDSO-N8
|
R-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Length |
6 mm
|
|
| Memory Density |
2048 bit
|
2048 bit
|
| Memory IC Type |
CRYPTO MEMORY
|
MEMORY CIRCUIT
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256X8
|
256X8
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVSON
|
DIE
|
| Package Equivalence Code |
SOLCC8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
4.9 mm
|
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
WAFER
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|