AT89C51RB2-3CSIM
vs
AT89C51RB2-SLSCM
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
On Chip Program ROM Width |
8
|
8
|
PWM Channels |
YES
|
YES
|
ROM (words) |
16384
|
16384
|
ROM Programmability |
FLASH
|
FLASH
|
Speed |
60 MHz
|
40 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
5 V
|
Supply Voltage-Nom |
3 V
|
5 V
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
LCC
|
Package Description |
|
QCCJ, LDCC44,.7SQ
|
Pin Count |
|
44
|
Address Bus Width |
|
16
|
CPU Family |
|
8051
|
External Data Bus Width |
|
8
|
JESD-30 Code |
|
S-PQCC-J44
|
JESD-609 Code |
|
e0
|
Length |
|
16.55 mm
|
Moisture Sensitivity Level |
|
2
|
Number of I/O Lines |
|
32
|
Number of Terminals |
|
44
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
QCCJ
|
Package Equivalence Code |
|
LDCC44,.7SQ
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
|
225
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
1280
|
Seated Height-Max |
|
4.57 mm
|
Supply Current-Max |
|
29 mA
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
J BEND
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
QUAD
|
Width |
|
16.55 mm
|
|
|
|
Compare AT89C51RB2-3CSIM with alternatives
Compare AT89C51RB2-SLSCM with alternatives