AT91SAM9260B-CU
vs
AT91SAM9260B-QU
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
0.80 MM PITCH, GREEN, MO-205, LFBGA-217
|
0.50 MM PITCH, GREEN, PLASTIC, MS-022, QFP-208
|
| Pin Count |
217
|
208
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 3.3V SUPPLY
|
ALSO OPERATES AT 3.3V SUPPLY
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B217
|
S-PQFP-G208
|
| JESD-609 Code |
e8
|
e3
|
| Length |
15 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
96
|
96
|
| Number of Terminals |
217
|
208
|
| On Chip Program ROM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
FQFP
|
| Package Equivalence Code |
BGA217,17X17,32
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
8192
|
8192
|
| ROM (words) |
0
|
0
|
| ROM Programmability |
ROMLESS
|
ROMLESS
|
| Seated Height-Max |
1.4 mm
|
4.1 mm
|
| Speed |
210 MHz
|
210 MHz
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
15 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AT91SAM9260B-CU with alternatives
Compare AT91SAM9260B-QU with alternatives