AT91SAM9G20-CU
vs
AT91SAM9G20B-CU-999
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Part Package Code |
BGA
|
|
| Package Description |
Lfbga, Bga217,17x17,32
|
Lfbga, Bga217,17x17,32
|
| Pin Count |
217
|
217
|
| Reach Compliance Code |
Unknown
|
Compliant
|
| ECCN Code |
3A991.a.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.25
|
8542.31.00.01
|
| Has ADC |
Yes
|
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
Yes
|
Yes
|
| Clock Frequency-Max |
50 Mhz
|
50 Mhz
|
| DAC Channels |
No
|
|
| DMA Channels |
Yes
|
|
| External Data Bus Width |
32
|
32
|
| Format |
Fixed Point
|
Fixed Point
|
| Integrated Cache |
Yes
|
Yes
|
| JESD-30 Code |
S-PBGA-B217
|
S-PBGA-B217
|
| Length |
15 Mm
|
15 Mm
|
| Low Power Mode |
Yes
|
Yes
|
| Number of DMA Channels |
24
|
24
|
| Number of External Interrupts |
3
|
3
|
| Number of I/O Lines |
96
|
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
217
|
217
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
Yes
|
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA217,17X17,32
|
BGA217,17X17,32
|
| Package Shape |
Square
|
Square
|
| Package Style |
Grid Array, Low Profile, Fine Pitch
|
Grid Array, Low Profile, Fine Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
16384
|
|
| ROM (words) |
65536
|
|
| ROM Programmability |
Flash
|
|
| Seated Height-Max |
1.4 Mm
|
1.4 Mm
|
| Speed |
400 Mhz
|
400 Mhz
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Form |
Ball
|
Ball
|
| Terminal Pitch |
0.8 Mm
|
0.8 Mm
|
| Terminal Position |
Bottom
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
15 Mm
|
15 Mm
|
| uPs/uCs/Peripheral ICs Type |
Microprocessor, Risc
|
Microprocessor, Risc
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
LFBGA-217
|
| Factory Lead Time |
|
15 Weeks
|
| JESD-609 Code |
|
e1
|
| On Chip Data RAM Width |
|
8
|
| RAM (words) |
|
32768
|
| Screening Level |
|
Ts 16949
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
|
|