AT91SAM9G20B-CFU
vs
AT91SAM9260B-CU
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
TFBGA-247
|
0.80 MM PITCH, GREEN, MO-205, LFBGA-217
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
9 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| CPU Family |
ARM9
|
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B247
|
S-PBGA-B217
|
| Length |
10 mm
|
15 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
24
|
|
| Number of External Interrupts |
3
|
|
| Number of I/O Lines |
96
|
96
|
| Number of Serial I/Os |
11
|
|
| Number of Terminals |
247
|
217
|
| Number of Timers |
4
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA247,19X19,20
|
BGA217,17X17,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
16384
|
8192
|
| ROM (words) |
0
|
0
|
| ROM Programmability |
ROMLESS
|
ROMLESS
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.1 mm
|
1.4 mm
|
| Speed |
400 MHz
|
210 MHz
|
| Supply Current-Max |
0.75 mA
|
|
| Supply Voltage-Max |
1.1 V
|
1.95 V
|
| Supply Voltage-Min |
0.9 V
|
1.65 V
|
| Supply Voltage-Nom |
1 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
10 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
217
|
| Additional Feature |
|
ALSO OPERATES AT 3.3V SUPPLY
|
| JESD-609 Code |
|
e8
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
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