BA4118FV vs CMX823P3 feature comparison

BA4118FV ROHM Semiconductor

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CMX823P3 CML Microcircuits Plc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD CML MICROCIRCUITS LTD
Part Package Code SOIC DIP
Package Description LSSOP, DIP,
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDIP-T16
Length 5 mm 19.685 mm
Number of Functions 1 1
Number of Terminals 16 16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.25 mm 5.08 mm
Supply Voltage-Nom 1.4 V 5 V
Surface Mount YES NO
Telecom IC Type PAGING RECEIVER PAGING DECODER
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 7.62 mm
Base Number Matches 5 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Supply Current-Max 3 mA
Temperature Grade INDUSTRIAL

Compare BA4118FV with alternatives

Compare CMX823P3 with alternatives