BA891T/R
vs
934055282115
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SC-79
|
SC-79
|
| Package Description |
R-PDSO-F2
|
ULTRA SMALL, PLASTIC, SMD, UFP, SC-79, 2 PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.60
|
8541.10.00.60
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
1.05 pF
|
1.05 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
|
| Frequency Band |
VERY HIGH FREQUENCY
|
VERY HIGH FREQUENCY
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
0.1 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.715 W
|
0.715 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
35 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
PLANAR DOPED BARRIER
|
PLANAR DOPED BARRIER
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BA891T/R with alternatives
Compare 934055282115 with alternatives