BAP50-04,215 vs BAP50-04W,115 feature comparison

BAP50-04,215 NXP Semiconductors

Buy Now Datasheet

BAP50-04W,115 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TO-236 SC-70
Package Description PLASTIC, SMD, SST3, 3 PIN PLASTIC, SC-70, 3 PIN
Pin Count 3 3
Manufacturer Package Code SOT23 SOT323
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00 8541.10.00
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP NXP
Breakdown Voltage-Min 50 V 50 V
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Capacitance-Max 0.6 pF 0.6 pF
Diode Capacitance-Nom 0.45 pF 0.45 pF
Diode Element Material SILICON SILICON
Diode Forward Resistance-Max 5 Ω 5 Ω
Diode Res Test Current 0.5 mA 0.5 mA
Diode Res Test Frequency 100 MHz 100 MHz
Diode Type PIN DIODE PIN DIODE
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e3
Minority Carrier Lifetime-Nom 1.05 µs 1.05 µs
Moisture Sensitivity Level 1 1
Number of Elements 2 2
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Power Dissipation-Max 0.25 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1
Reverse Test Voltage

Compare BAP50-04,215 with alternatives

Compare BAP50-04W,115 with alternatives