BAP64-02,115 vs BAP64-03,115 feature comparison

BAP64-02,115 NXP Semiconductors

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BAP64-03,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOD SOD
Package Description ULTRA SMALL, PLASTIC, SC-79, 2 PIN PLASTIC, SMD, SC-76, 2 PIN
Pin Count 2 2
Manufacturer Package Code SOD523 SOD323
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00 8541.10.00
Factory Lead Time 13 Weeks 14 Weeks, 4 Days
Samacsys Manufacturer NXP NXP
Additional Feature HIGH VOLTAGE HIGH VOLTAGE
Application ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING
Breakdown Voltage-Min 175 V 175 V
Configuration SINGLE SINGLE
Diode Capacitance-Max 0.35 pF 0.35 pF
Diode Capacitance-Nom 0.48 pF 0.52 pF
Diode Element Material SILICON SILICON
Diode Forward Resistance-Max 1.35 Ω 1.35 Ω
Diode Res Test Current 0.5 mA 0.5 mA
Diode Res Test Frequency 100 MHz 100 MHz
Diode Type PIN DIODE PIN DIODE
Frequency Band S BAND S BAND
JESD-30 Code R-PDSO-F2 R-PDSO-G2
JESD-609 Code e3 e3
Minority Carrier Lifetime-Nom 1.55 µs 1.55 µs
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Power Dissipation-Max 0.715 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reverse Test Voltage
Surface Mount YES YES
Technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form FLAT GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1

Compare BAP64-02,115 with alternatives

Compare BAP64-03,115 with alternatives