BAP64-02,115
vs
BAP64-03T/R
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOD
SC-76
Package Description
ULTRA SMALL, PLASTIC, SC-79, 2 PIN
R-PDSO-G2
Pin Count
2
2
Manufacturer Package Code
SOD523
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00
8541.10.00.80
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Additional Feature
HIGH VOLTAGE
HIGH VOLTAGE
Application
ATTENUATOR; SWITCHING
ATTENUATOR; SWITCHING
Breakdown Voltage-Min
175 V
175 V
Configuration
SINGLE
SINGLE
Diode Capacitance-Max
0.35 pF
0.35 pF
Diode Capacitance-Nom
0.48 pF
Diode Element Material
SILICON
SILICON
Diode Forward Resistance-Max
1.35 Ω
1.35 Ω
Diode Res Test Current
0.5 mA
Diode Res Test Frequency
100 MHz
Diode Type
PIN DIODE
PIN DIODE
Frequency Band
S BAND
S BAND
JESD-30 Code
R-PDSO-F2
R-PDSO-G2
JESD-609 Code
e3
e3
Minority Carrier Lifetime-Nom
1.55 µs
1.55 µs
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max
0.715 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reverse Test Voltage
Surface Mount
YES
YES
Technology
POSITIVE-INTRINSIC-NEGATIVE
POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish
Tin (Sn)
TIN
Terminal Form
FLAT
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Pbfree Code
Yes
Compare BAP64-02,115 with alternatives
Compare BAP64-03T/R with alternatives