BAP64-02,115 vs BAP64-03T/R feature comparison

BAP64-02,115 NXP Semiconductors

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BAP64-03T/R NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOD SC-76
Package Description ULTRA SMALL, PLASTIC, SC-79, 2 PIN R-PDSO-G2
Pin Count 2 2
Manufacturer Package Code SOD523
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00 8541.10.00.80
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Additional Feature HIGH VOLTAGE HIGH VOLTAGE
Application ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING
Breakdown Voltage-Min 175 V 175 V
Configuration SINGLE SINGLE
Diode Capacitance-Max 0.35 pF 0.35 pF
Diode Capacitance-Nom 0.48 pF
Diode Element Material SILICON SILICON
Diode Forward Resistance-Max 1.35 Ω 1.35 Ω
Diode Res Test Current 0.5 mA
Diode Res Test Frequency 100 MHz
Diode Type PIN DIODE PIN DIODE
Frequency Band S BAND S BAND
JESD-30 Code R-PDSO-F2 R-PDSO-G2
JESD-609 Code e3 e3
Minority Carrier Lifetime-Nom 1.55 µs 1.55 µs
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.715 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reverse Test Voltage
Surface Mount YES YES
Technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn) TIN
Terminal Form FLAT GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Pbfree Code Yes

Compare BAP64-02,115 with alternatives

Compare BAP64-03T/R with alternatives