BAP65-02,135
vs
934056549115
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOD
|
SC-70
|
Pin Count |
2
|
3
|
Manufacturer Package Code |
SOD523
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00
|
8541.10.00.80
|
Factory Lead Time |
13 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Breakdown Voltage-Min |
30 V
|
30 V
|
Configuration |
SINGLE
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Capacitance-Max |
0.9 pF
|
0.9 pF
|
Diode Capacitance-Nom |
0.65 pF
|
|
Diode Forward Resistance-Max |
0.9 Ω
|
0.9 Ω
|
Diode Res Test Current |
5 mA
|
|
Diode Res Test Frequency |
100 MHz
|
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
JESD-609 Code |
e3
|
|
Minority Carrier Lifetime-Nom |
0.17 µs
|
0.17 µs
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
2
|
Operating Temperature-Max |
150 °C
|
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Reverse Test Voltage |
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin (Sn)
|
Pure Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Base Number Matches |
1
|
1
|
Package Description |
|
PLASTIC, SMD, SC-70, 3 PIN
|
Application |
|
ATTENUATOR; SWITCHING
|
Diode Element Material |
|
SILICON
|
JESD-30 Code |
|
R-PDSO-G3
|
Number of Terminals |
|
3
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Power Dissipation-Max |
|
0.24 W
|
Qualification Status |
|
Not Qualified
|
Technology |
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
|
|
|
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