BAS116LPH4-7B
vs
BAS116-7
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
DFN
|
|
| Package Description |
Dfn1006-2, 2 Pin
|
Plastic Package-3
|
| Pin Count |
2
|
3
|
| Reach Compliance Code |
Compliant
|
Not Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Factory Lead Time |
12 Weeks
|
|
| Additional Feature |
Low Leakage Current
|
Low Leakage Current
|
| Application |
General Purpose
|
General Purpose
|
| Breakdown Voltage-Min |
85 V
|
|
| Configuration |
Single
|
Single
|
| Diode Element Material |
Silicon
|
Silicon
|
| Diode Type |
Rectifier Diode
|
Rectifier Diode
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JESD-30 Code |
R-PBCC-N2
|
R-PDSO-G3
|
| JESD-609 Code |
e4
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
0.5 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.215 A
|
0.215 A
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Chip Carrier
|
Small Outline
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
0.3 W
|
0.25 W
|
| Rep Pk Reverse Voltage-Max |
85 V
|
85 V
|
| Reverse Current-Max |
0.005 µA
|
|
| Reverse Recovery Time-Max |
3 µS
|
3 µS
|
| Reverse Test Voltage |
75 V
|
|
| Surface Mount |
Yes
|
Yes
|
| Terminal Finish |
Nickel Palladium Gold
|
Tin Lead
|
| Terminal Form |
No Lead
|
Gull Wing
|
| Terminal Position |
Bottom
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Qualification Status |
|
Not Qualified
|
|
|
|