BAS17,215
vs
BAS17T/R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Part Package Code |
TO-236
|
|
| Package Description |
R-PDSO-G3
|
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
SOT23
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
STABISTOR DIODE
|
STABISTOR DIODE
|
| Forward Voltage-Max (VF) |
0.96 V
|
|
| Forward Voltage-Min (VF) |
0.87 V
|
|
| JEDEC-95 Code |
TO-236AB
|
|
| JESD-30 Code |
R-PDSO-G3
|
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
|
| Number of Terminals |
3
|
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.25 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reverse Test Voltage |
4 V
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2017-02-01
|
|
|
|
Compare BAS17,215 with alternatives
Compare BAS17T/R with alternatives