BAS216/T3
vs
BAS21
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Package Description |
R-CDSO-R2
|
PLASTIC PACKAGE-3
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.70
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JESD-30 Code |
R-CDSO-R2
|
R-PDSO-G3
|
| Non-rep Pk Forward Current-Max |
4 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
150 °C
|
|
| Output Current-Max |
0.25 A
|
0.2 A
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.4 W
|
0.35 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
85 V
|
200 V
|
| Reverse Current-Max |
1 µA
|
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.05 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN OVER COPPER
|
|
| Terminal Form |
WRAP AROUND
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
58
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare BAS216/T3 with alternatives
Compare BAS21 with alternatives