BAT17,235
vs
BAT17T/R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-236
|
SOT-23
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
SOT23
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8541.10.00.70
|
8541.10.00.60
|
| Factory Lead Time |
4 Weeks
|
|
| Breakdown Voltage-Min |
4 V
|
4 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
1 pF
|
1 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| Forward Voltage-Max (VF) |
0.6 V
|
0.6 V
|
| Frequency Band |
ULTRA HIGH FREQUENCY
|
ULTRA HIGH FREQUENCY
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Noise Figure-Max |
8 dB
|
8 dB
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Output Current-Max |
30 A
|
30 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Current-Max |
0.25 µA
|
0.25 µA
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
PLASTIC, SMD, 3 PIN
|
| ECCN Code |
|
EAR99
|
| JEDEC-95 Code |
|
TO-236AB
|
|
|
|
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