BAT17T/R
vs
BAT17,235
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOT-23
|
TO-236
|
Package Description |
PLASTIC, SMD, 3 PIN
|
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.60
|
8541.10.00.70
|
Breakdown Voltage-Min |
4 V
|
4 V
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
1 pF
|
1 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
MIXER DIODE
|
MIXER DIODE
|
Forward Voltage-Max (VF) |
0.6 V
|
0.6 V
|
Frequency Band |
ULTRA HIGH FREQUENCY
|
ULTRA HIGH FREQUENCY
|
JEDEC-95 Code |
TO-236AB
|
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Noise Figure-Max |
8 dB
|
8 dB
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Output Current-Max |
30 A
|
30 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Current-Max |
0.25 µA
|
0.25 µA
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
MATTE TIN
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Manufacturer Package Code |
|
SOT23
|
Factory Lead Time |
|
4 Weeks
|
Moisture Sensitivity Level |
|
1
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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