BAT54CM,315 vs BAT54A,235 feature comparison

BAT54CM,315 NXP Semiconductors

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BAT54A,235 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DFN TO-236
Package Description 1 X 0.60 MM, 0.50 MM HEIGHT, ULTRA SMALL, PLASTIC, SC-101, 3 PIN PLASTIC PACKAGE-3
Pin Count 3 3
Manufacturer Package Code SOT883 SOT23
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Configuration COMMON CATHODE, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.24 V 1 V
JESD-30 Code R-PBCC-N3 R-PDSO-G3
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Non-rep Pk Forward Current-Max 0.6 A 0.6 A
Number of Elements 2 2
Number of Terminals 3 3
Operating Temperature-Max 150 °C 125 °C
Output Current-Max 0.2 A 0.2 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Power Dissipation-Max 0.25 W 0.23 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 30 V 30 V
Surface Mount YES YES
Technology SCHOTTKY SCHOTTKY
Terminal Finish TIN TIN
Terminal Form NO LEAD GULL WING
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1
JEDEC-95 Code TO-236AB
Reverse Current-Max 2 µA
Reverse Recovery Time-Max 0.005 µs

Compare BAT54CM,315 with alternatives

Compare BAT54A,235 with alternatives