BAW56S,115
vs
BAW56S
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
|
Package Description |
PLASTIC, SMD, SC-88, 6 PIN
|
|
Pin Count |
6
|
|
Manufacturer Package Code |
SOT363
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
|
Configuration |
2 BANKS, COMMON ANODE, 2 ELEMENTS
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
RECTIFIER DIODE
|
|
Forward Voltage-Max (VF) |
0.715 V
|
1.3 V
|
JESD-30 Code |
R-PDSO-G6
|
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
4
|
|
Number of Terminals |
6
|
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Output Current-Max |
0.25 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Dissipation-Max |
0.35 W
|
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
90 V
|
85 V
|
Reverse Current-Max |
150 µA
|
2.5 µA
|
Reverse Recovery Time-Max |
0.004 µs
|
0.006 µs
|
Reverse Test Voltage |
80 V
|
70 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
5
|
|
|
|
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