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BAW56S,115 vs BAW56S,135 feature comparison

BAW56S,115 NXP Semiconductors

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BAW56S,135 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description PLASTIC, SMD, SC-88, 6 PIN PLASTIC, SMD, SC-88, 6 PIN
Pin Count 6 6
Manufacturer Package Code SOT363 SOT363
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Configuration 2 BANKS, COMMON ANODE, 2 ELEMENTS 2 BANKS, COMMON ANODE, 2 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 0.715 V 0.715 V
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 4 4
Number of Terminals 6 6
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Output Current-Max 0.25 A 0.25 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Power Dissipation-Max 0.35 W 0.35 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 90 V 90 V
Reverse Current-Max 150 µA 150 µA
Reverse Recovery Time-Max 0.004 µs 0.004 µs
Reverse Test Voltage 80 V 80 V
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 2
Diodes » Rectifier Diodes
Diodes » Rectifier Diodes

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